Earlier this week AMD announced the new AMD Milan-X CPU. This new chip harnesses the Ryzen 3D V-cache technology previously demonstrated in August this year. Providing users with similar features as the AMD EPYC 7003 series + a massive boost in L3 cache capacity.
What is AMD Milan-X?
The AMD Milan-X is built on top of AMD’s Zen3 Milan chips, the same chips found within the EPYC 7003 series but with the distinct difference of additional cache die space on top the main logic cache. This additional space provides a total of 804MB of cache per socket, tripling the L3 cache that was previously possible. The Milan-X also comes equipped with direct copper connections providing high performance and density within the chip-to-chip stacking interconnect.
The Benefit behind AMD’s methodology with the Milan-X is being able to add cache while also minimizing the power usage in order to add that same cache. Whilst providing a incredibly high performance solution.
AMD also stated that the Milan-X socket will be compatible with Windows XP Service Pack 3 (SP3).
The AMD Milan-X is confirmed to be officially released in Q1 of 2022 but full consumer availability will most likely be closer to Q2 2022. The GODBOX architecture is currently in early testing of the Milan-X; testing the new L3 cache capacity and reliability. GODBOX will be moving over to the new Milan-X CPU’s for Q2 of 2022.
AMD Accelerated Data Center Premiere Keynote: